君正集成電路 M200嵌入式主板簡介

CPU

XBurst-HP core, 1.2GHz (MIPS-based).

XBurst-LP core, 300MHz (MIPS-based).

32KB L1 I-cache and 32KB L1 D-cache for each core.

GPU

3D GPU with OpenGL ES 2.0/1.1 compliant.

VPU

Video encoder: H.264, VP8, 720P@30fps.

ISP

Wide Dynamic Range (EDR), dual-stream processing.

Video and still image stabilization.

Image cropping and rescaling.

Auto exposure and gain control.

Auto white balancing and auto focus control.

Edge sharpening and advanced noise reduction.

Color correction and management.

Auto contrast enhancement and Gamma correction.

Special digital effects.

Memory

DDR2, DDR3, LPDDR, LPDDR2, up to 667Mbps.

16 and 32 bit external DDR data width.

64-bit ECC NAND flash support, 512B/2KB/4KB/8KB/16KB page size.

Toggle1.0 and ONFI2.0 NAND.

2 channels high performance PDMA, and 30 channels general purpose DMA.

Display

LCD controller with OSD: TFT, SLCD and MIPI-DSI (2-lanes).

Embedded E-Ink controller.

Camera

MIPI-CSI2 (2-lanes) and DVP interface.

Audio

Embedded audio CODEC.

Low power DMIC controller.

AC97/I2S/SPDIF interface for external audio codec.

PCM interface, master and slave mode.

Voice Trigger Engine

System wakeup on specific voice command, programmable.

ADC

3 channels SAR A/D controller, 12-bit resolution.

On-chip Peripherals

USB 2.0 OTG.

MMC/SD/SDIO controller.

Full-duplex UART port.

Synchronous serial interface.

Two-wire SMB serial interface.

Security

Total 4KB OTP memory.

Highest lever 1 security boot.

Package

BGA270, 7.7 x 8.9 x 0.76 (mm), 0.4mm pitch.

OS

Android 5.1 and beyond.