200μm HPCF Fiber for Data-communication
Molex 200μmHPCF fiber for data-communications,crimp and cleave compatible
說明：Molex 200μmHPCF fiber for data-communications,crimp and cleave compatible
Characteristics
○ Step index
○ Low-OH,synthetic fused silica core,PolyClad hard polymer clad,ETFE buffer or jacket
○ Broad operating wavelength range, optimized at 650 and 850nm
○ Minimal connector offsets due to high clad/core diameter ratio
○ High tensile strength and minimal bend radius for high reliability
○ Crimp/cleave and epoxy/polish compatible
○ Large core and high na provides easy termination and high coupling efficiency to light source
○ Chemically resistant
○ Flame retardant
○ Short-to-medium distance data communications for factory automation and process control
○ ROHS compliant
Specifications
Applications
Chemical plants
Refineries
Avionics
Automotive Production/manufacturing plants
Mobile platforms
Wind power
Power plants
PLC’S
