我們是AGM的長(zhǎng)期授權(quán)代理商，可以為用戶提供最具競(jìng)爭(zhēng)力的價(jià)格與技術(shù)支持服務(wù)。
功能替換 Altera Xilinx Lattice MicroSemi FPGA：
AG10KSDE176
Altera：EP3C10 EP4CE10
Xilinx：XC3S400 XC6SLX9
Lattice：LFXP2-8E LFE2-12SE
MicroSemi：M2S005 M2S010
AG10K(+MCU) SoC AG10KSDE176
可以替代部分STM32F1XX的應(yīng)用功能
FPGA+MCU SoC family device, integrates high performance FPGA logic with low-power MCU core in a single die one silicon, targets consumer and industrial's mass-volume market with low-cost and high-performance SoC. The device features integrated rich functions with 16K LUTs and MCU core with 250MHz.
MCU hard-IP is embedded within FPGA logic fabric, and all mcu internal IOs are connectable to device's IO pad, and/or internal FPGA's logic as user demands. Cortex MCU, with usable code space up to 64 KByte RAM, is programmable through spiflash, and JTAG for testing purposes. Additionally,
Features
High-density architecture with 10K LEs
M9K embedded memory blocks, up to 414Kbits of RAM space
Up to 23 18 x 18-bit embedded multipliers are each configurable as two independent 9 x 9-bit multipliers
Provides 2 PLLs per device provide clock multiplication and phase shifting
High-speed differential I/O standard support, including LVDS, RSDS, mini-LVDS, LVPECL
Single-ended I/O standard support, including 3.3V, 2.5V, 1.8V, and 1.5V LVCMOS and LVTTL
General package options, LQFP-144, -176 and FBGA-256
Flexible device configuration through JTAG and SPI interface
Support remote update, by "dual-boot" like implementation
Packaging types include BGA256, and QFP144.
AG10KSDE176(+MCU)+SDRAM device is AG10KSDE176(+MCU) SoC bonded with 64MBit 32-bit 166MHz SDRAM die. EQFP-176 package is provided as industrial grade, is pin-to-pin compatible with AG16KSDE176(+MCU)+SDRAM.
MCU hard-IP is embedded within FPGA logic fabric, and all mcu internal IOs are connectable to device's IO pad, and/or internal FPGA's logic as user demands. MCU core, with usable code space up to 64 KByte RAM, is programmable through spiflash, and JTAG for testing purposes.
AGM(遨格芯)2012年起步于僅是 FPGA IP 軟核和軟件授權(quán)公司, 2014年轉(zhuǎn)入芯片業(yè)務(wù)，CPLD芯片已經(jīng)成熟，并且開(kāi)始在行業(yè)有了一些應(yīng)用，看到智能手機(jī)風(fēng)口的AGM也不失時(shí)機(jī)出了一款用于智能手機(jī)和loT的FPGA芯片，并且通過(guò)了三星嚴(yán)格的供應(yīng)商測(cè)試認(rèn)證，成為三星Galaxy手機(jī)里除Lattice之外的唯一備選FPGA器件，實(shí)現(xiàn)了國(guó)內(nèi)FPGA公司出口零的突破，具有特殊的戰(zhàn)略意義。
AGM在軟件和電路上擁有自主知識(shí)產(chǎn)權(quán)，在產(chǎn)品方面目前走的是兼容主流大廠并軟硬件生態(tài)不變的路線，在芯片內(nèi)部接口兼容主流廠商器件，PCB板級(jí)可以直接替換并用AGM編譯軟件導(dǎo)入燒寫(xiě)，AGM目前供貨器件可以直接替換：
CPLD系列，針對(duì)Altera MAX II系列，包括EPM240T100，EPM570T144，EPM570T100
低端FPGA SoC系列，針對(duì)Altera Cyclone III 系列FPGA：EP3C5E、EP3C5F、EP3C10E、EP3C10F、EP3C16F； Cyclone IV 系列FPGA：EP4CE6、EP4CE10、EP4CE15
高端FPGA SoC系列BlueWind，針對(duì)Xilinx Virtex系列。
以下是替代列表：
綠色料號(hào)，直接PINtoPIN，不需要重新畫(huà)板、打板，也不需要重新編程。
包裝規(guī)格：
