電子元器件封裝中的界面控制技術

概述了電子設備行業(yè)為了實現(xiàn)小型、輕量化與高速、大容量的信息傳輸，對電子元器件及裝 置實施小型化、高密度組裝、微細導線、最短連線所需的三維組裝和立體電路成形技術。論述了電子 元器件組裝中所采用的高分子材料及對其高性能的期望、金屬與高分子材料的連接所應用的界面 控制技術。討論了界面控制技術的具體應用，如多層線路板、半導體密封材料、異向性導電連接材 料、半導體制造工程用粘結帶等。
關鍵詞：系統(tǒng)內組裝；微內部連接；高分子材料；粘結帶；集成電路
Abstract：Make a brief introduction of electric equipment industry S new technology for information transfer from small size and light weight to high speed and capacity，and tridimensional assembly and electrocircult technology for electric component and instrument S need of miniaturization， high density， micro wire and the shortest wire splice．Dissertate macromolecular material and expect for its perform ance，and interface
control technology of metal and macromolecular material connect．Also refor to interface control technology application such as multi—layers board， multi—conductor package material， the different tropism electric conduction material，adhesives tape for multi-conductor manufacture and SO on．
Key word：system in package；micro interconnection；polymer；adhesive tape； integrated circui