高速PCB基礎(chǔ)理論及內(nèi)存仿真技術(shù)(經(jīng)典推薦)

第一部分 信號完整性知識基礎(chǔ).................................................................................5
第一章 高速數(shù)字電路概述.....................................................................................5
1.1 何為高速電路...............................................................................................5
1.2 高速帶來的問題及設(shè)計流程剖析...............................................................6
1.3 相關(guān)的一些基本概念...................................................................................8
第二章 傳輸線理論...............................................................................................12
2.1 分布式系統(tǒng)和集總電路.............................................................................12
2.2 傳輸線的RLCG 模型和電報方程...............................................................13
2.3 傳輸線的特征阻抗.....................................................................................14
2.3.1 特性阻抗的本質(zhì).................................................................................14
2.3.2 特征阻抗相關(guān)計算.............................................................................15
2.3.3 特性阻抗對信號完整性的影響.........................................................17
2.4 傳輸線電報方程及推導.............................................................................18
2.5 趨膚效應(yīng)和集束效應(yīng).................................................................................23
2.6 信號的反射.................................................................................................25
2.6.1 反射機理和電報方程.........................................................................25
2.6.2 反射導致信號的失真問題.................................................................30
2.6.2.1 過沖和下沖.....................................................................................30
2.6.2.2 振蕩：.............................................................................................31
2.6.3 反射的抑制和匹配.............................................................................34
2.6.3.1 串行匹配.........................................................................................35
2.6.3.1 并行匹配.........................................................................................36
2.6.3.3 差分線的匹配.................................................................................39
2.6.3.4 多負載的匹配.................................................................................41
第三章 串擾的分析...............................................................................................42
3.1 串擾的基本概念.........................................................................................42
3.2 前向串擾和后向串擾.................................................................................43
3.3 后向串擾的反射.........................................................................................46
3.4 后向串擾的飽和.........................................................................................46
3.5 共模和差模電流對串擾的影響.................................................................48
3.6 連接器的串擾問題.....................................................................................51
3.7 串擾的具體計算.........................................................................................54
3.8 避免串擾的措施.........................................................................................57
第四章 EMI 抑制....................................................................................................60
4.1 EMI/EMC 的基本概念..................................................................................60
4.2 EMI 的產(chǎn)生..................................................................................................61
4.2.1 電壓瞬變.............................................................................................61
4.2.2 信號的回流.........................................................................................62
4.2.3 共模和差摸EMI ..................................................................................63
4.3 EMI 的控制..................................................................................................65
4.3.1 屏蔽.....................................................................................................654.3.1.1 電場屏蔽.........................................................................................65
4.3.1.2 磁場屏蔽.........................................................................................67
4.3.1.3 電磁場屏蔽.....................................................................................67
4.3.1.4 電磁屏蔽體和屏蔽效率.................................................................68
4.3.2 濾波.....................................................................................................71
4.3.2.1 去耦電容.........................................................................................71
4.3.2.3 磁性元件.........................................................................................73
4.3.3 接地.....................................................................................................74
4.4 PCB 設(shè)計中的EMI.......................................................................................75
4.4.1 傳輸線RLC 參數(shù)和EMI ........................................................................76
4.4.2 疊層設(shè)計抑制EMI ..............................................................................77
4.4.3 電容和接地過孔對回流的作用.........................................................78
4.4.4 布局和走線規(guī)則.................................................................................79
第五章 電源完整性理論基礎(chǔ)...............................................................................82
5.1 電源噪聲的起因及危害.............................................................................82
5.2 電源阻抗設(shè)計.............................................................................................85
5.3 同步開關(guān)噪聲分析.....................................................................................87
5.3.1 芯片內(nèi)部開關(guān)噪聲.............................................................................88
5.3.2 芯片外部開關(guān)噪聲.............................................................................89
5.3.3 等效電感衡量SSN ..............................................................................90
5.4 旁路電容的特性和應(yīng)用.............................................................................92
5.4.1 電容的頻率特性.................................................................................93
5.4.3 電容的介質(zhì)和封裝影響.....................................................................95
5.4.3 電容并聯(lián)特性及反諧振.....................................................................95
5.4.4 如何選擇電容.....................................................................................97
5.4.5 電容的擺放及Layout ........................................................................99
第六章 系統(tǒng)時序.................................................................................................100
6.1 普通時序系統(tǒng)...........................................................................................100
6.1.1 時序參數(shù)的確定...............................................................................101
6.1.2 時序約束條件...................................................................................106

3.2 高速設(shè)計的問題.......................................................................................209
3.3 SPECCTRAQuest SI Expert 的組件.......................................................210
3.3.1 SPECCTRAQuest Model Integrity .................................................210
3.3.2 SPECCTRAQuest Floorplanner/Editor .........................................215
3.3.3 Constraint Manager .......................................................................216
3.3.4 SigXplorer Expert Topology Development Environment .......223
3.3.5 SigNoise 仿真子系統(tǒng)......................................................................225
3.3.6 EMControl .........................................................................................230
3.3.7 SPECCTRA Expert 自動布線器.......................................................230
3.4 高速設(shè)計的大致流程...............................................................................230
3.4.1 拓撲結(jié)構(gòu)的探索...............................................................................231
3.4.2 空間解決方案的探索.......................................................................231
3.4.3 使用拓撲模板驅(qū)動設(shè)計...................................................................231
3.4.4 時序驅(qū)動布局...................................................................................232
3.4.5 以約束條件驅(qū)動設(shè)計.......................................................................232
3.4.6 設(shè)計后分析.......................................................................................233
第四章 SPECCTRAQUEST SIGNAL EXPLORER 的進階運用..........................................234
4.1 SPECCTRAQuest Signal Explorer 的功能包括：................................234
4.2 圖形化的拓撲結(jié)構(gòu)探索...........................................................................234
4.3 全面的信號完整性(Signal Integrity)分析.......................................234
4.4 完全兼容 IBIS 模型...............................................................................234
4.5 PCB 設(shè)計前和設(shè)計的拓撲結(jié)構(gòu)提取.......................................................235
4.6 仿真設(shè)置顧問...........................................................................................235
4.7 改變設(shè)計的管理.......................................................................................235
4.8 關(guān)鍵技術(shù)特點...........................................................................................236
4.8.1 拓撲結(jié)構(gòu)探索...................................................................................236
4.8.2 SigWave 波形顯示器........................................................................236
4.8.3 集成化的在線分析(Integration and In-process Analysis) .236
第五章 部分特殊的運用...............................................................................237
5.1 Script 指令的使用..................................................................................237
5.2 差分信號的仿真.......................................................................................243
5.3 眼圖模式的使用.......................................................................................249
第四部分：HYPERLYNX 仿真工具使用指南............................................................251
第一章 使用LINESIM 進行前仿真.......................................................................251
1.1 用LineSim 進行仿真工作的基本方法...................................................251
1.2 處理信號完整性原理圖的具體問題.......................................................259
1.3 在LineSim 中如何對傳輸線進行設(shè)置...................................................260
1.4 在LineSim 中模擬IC 元件.....................................................................263
1.5 在LineSim 中進行串擾仿真...................................................................268
第二章 使用BOARDSIM 進行后仿真......................................................................273
2.1 用BOARDSIM 進行后仿真工作的基本方法...................................................273
2.2 BoardSim 的進一步介紹..........................................................................292
2.3 BoardSim 中的串擾仿真..........................................................................309