芯和半導(dǎo)體多項(xiàng)技術(shù)演示亮相SFF和SAFE? Forum 2023
活動(dòng)簡(jiǎn)介
作為三星SAFE生態(tài)系統(tǒng)的重要合作伙伴之一，芯和半導(dǎo)體將于2023年6月27日-28日參加三星Foundry 論壇及SAFE論壇2023美國(guó)站（SFF & SAFE Forum 2023）的活動(dòng)。
在三星Foundry論壇中, 參與者能獲得三星的遠(yuǎn)景規(guī)劃及最新的技術(shù)創(chuàng)新，并聆聽(tīng)來(lái)自頂級(jí)技術(shù)專家和行業(yè)領(lǐng)袖嘉賓的演講。在三星 SAFE 論壇中, 您還將了解到三星SAFE合作伙伴分享的行業(yè)趨勢(shì)及在EDA, IP, DSP, 及Packaging領(lǐng)域的挑戰(zhàn)和解決方案，了解高性能計(jì)算和汽車領(lǐng)域的先進(jìn)設(shè)計(jì)解決方案，并在展館通過(guò)與SAFE合作伙伴的討論和合作，拓寬對(duì)行業(yè)趨勢(shì)和創(chuàng)新技術(shù)的見(jiàn)解。
技術(shù)演示
芯和半導(dǎo)體將在此次大會(huì)上帶來(lái)多項(xiàng)技術(shù)演示，包括：
Metis為3DIC Chiplet先進(jìn)封裝提供了完整的SI/PI/多物理場(chǎng)分析解決方案，支持包括三星I-Cube, H-Cube, R-Cube, X-Cube在內(nèi)的眾多主流先進(jìn)封裝工藝。
Metis多尺度能力和容量?jī)?yōu)勢(shì)能支持“裸芯片、中介層和基板“統(tǒng)一的 EM 仿真，突破了借助傳統(tǒng)工具“剪切再縫合”方法帶來(lái)的易錯(cuò)性和局限性。它的多模式分析選項(xiàng)為工程師提供了速度和精確性的選擇，滿足了從架構(gòu)探索到最終簽核的各個(gè)設(shè)計(jì)環(huán)節(jié)對(duì)仿真效率和精度的不同需求。
Metis在半導(dǎo)體行業(yè)國(guó)際在線平臺(tái)3D InCites的最新評(píng)選中勝出，獲封2023“Herb Reiter 年度最佳設(shè)計(jì)工具供應(yīng)商獎(jiǎng)”稱號(hào)。
IRIS：先進(jìn)工藝制程下的片上無(wú)源建模與仿真
芯和半導(dǎo)體射頻設(shè)計(jì)平臺(tái)支持從芯片、封裝、模組到板級(jí)的射頻全鏈路設(shè)計(jì)，包括射頻系統(tǒng)設(shè)計(jì)工具XDS、片上射頻及高速無(wú)源抽取工具IRIS、PDK建模及驗(yàn)證工具iModeler/iVerifier；IPD包括各種標(biāo)準(zhǔn)和定制集成無(wú)源器件及芯片電容等。
IRIS在三星多項(xiàng)先進(jìn)工藝節(jié)點(diǎn)上獲得認(rèn)證，包括三星8nm LPP FinFET 工藝及28FDS FD-SOI 工藝。憑借加速的3D EM求解器，先進(jìn)工藝支持以及與Virtuoso的無(wú)縫集成，IRIS能幫助RFIC設(shè)計(jì)人員實(shí)現(xiàn)首次設(shè)計(jì)即能成功的硅上體驗(yàn)。
大會(huì)議程
Samsung Foundry Forum Program:
Date:June 27th, 2023
Time:12:00 - 5:30pm PDT
Venue:Signia by Hilton San Jose, Imperial Ballroom
Address:170 S. Market St., San Jose, CA 95113
| Time | R/T(min) | Program |
|
12:00 - 13:00 |
60’ | Networking Lunch & Registration |
|
13:00 - 13:05 |
5’ | Opening(Jinman Han, EVP & Head of DSA Office, Samsung Electronics) |
|
13:05 - 13:20 |
15’ | Samsung Keynote(Siyoung Choi,President,Foundry Business, Samsung Electronics) |
|
13:20 - 13:35 |
15’ | “An Energy Efficient Future of AI”(Joe Macri, SVP, CTO of Computing & Graphics, AMD) |
|
13:35 - 13:50 |
15’ | “Meeting System User Demands in a Slowing Moore’s Law Era” (Chidi Chidambaram, Fellow, Technology and Foundry Engineering, Qualcomm) |
|
13:50 - 14:05 |
15’ | Break |
|
14:05 - 14:35 |
30’ | Process Technology(Gitae Jeong, EVP & Head of Technology Development, Samsung Electronics) |
|
14:35 - 14:50 |
15’ | Manufacturing Excellence (Sang Sup Jeong, EVP & Head of Manufacturing Technology, Samsung Electronics) |
|
14:50 - 15:10 |
20’ | Design Platform (Jongwook Kye, EVP & Head of Design Platform Development, Samsung Electronics) |
|
15:10 - 15:25 |
15’ | Sustainability(Claire Seo, VP, DS Corporate Sustainability Management, Samsung Electronics) |
|
15:25 - 15:40 |
15’ | Break |
|
15:40 - 15:55 |
15’ | “RiscV, AI, and the Next Generation of Compute” (Jim Keller, President & CEO, Tenstorrent) |
|
15:55 - 16:15 |
20’ | Advanced Heterogeneous Integration (Moonsoo Kang, EVP & Head of AVP Business Team, Samsung Electronics) |
|
16:15 - 16:35 |
20’ | Business & Customers (Sang-Pil Sim, EVP & Head of Foundry Worldwide Sales & Marketing, Samsung Electronics) |
|
16:35 - 16:40 |
5’ | Closing (Marco Chisari, EVP & Head of U.S. Foundry and SSIC, Samsung Electronics) |
|
16:40 - 17:30 |
50’ | Partner Pavilion & Networking |
SAFEForum Program:
Date:June 28th, 2023
Time:9:00am - 5:30pm PDT
Venue:Signia by Hilton San Jose, Imperial Ballroom & Regency Ballroom 1
Address:170 S. Market St., San Jose, CA 95113
| Time | R/T(min) | Program | |
|
09:00 - 10:00 |
60’ | Registration | |
|
10:00 - 10:05 |
5’ | Opening (Jinman Han, EVP & Head of DSA Office, Samsung Electronics) | |
|
10:05 - 10:15 |
10’ | Welcoming Remarks (Jongwook Kye, EVP & Head of Design Platform Development, Samsung Electronics) | |
|
10:15 - 10:35 |
20’ | “The 3Ps of 3D-ICs” (Ajei Gopal, President & CEO, Ansys) | |
|
10:35 - 10:55 |
20’ | “Unleashing a New Era of Compute with Chiplet-Powered Silicon” (Tony E. Pialis, President & CEO, Alphawave Semi) | |
|
10:55 - 11:15 |
20’ | “High-Performance Design in Samsung Foundry” (Leon Stok, VP, IBM) | |
|
11:15 - 11:35 |
20’ | Samsung Foundry Process & Business Update (Gibong Jeong, EVP & Head of Business Development, Samsung Electronics) | |
|
11:35 - 11:50 |
15’ | Break | |
|
11:50 - 12:50 |
60’ | Lunch (Partner Pavilion & Networking) | |
|
12:50 - 13:00 |
10’ | Break | |
|
13:00 - 16:15 |
195’ |
[Tech Session I] Advanced Technology and Design Infrastructure |
[Tech Session II] Advanced Design Solutions for HPC and Automotive |
|
Tech Talk: Sangyun Kim, VP & Head of Design Technology, Samsung Electronics Room: Imperial Ballroom Presenter: 8 partner presentations ADT, Ansys, ARM, Cadence, Synopsys |
Tech Talk: Jongshin Shin, EVP & Head of IP Ecosystem, Samsung Electronics Room: Regency Ballroom 1 Presenter: 8 partner presentations Alphawave, Cadence, CoAsia, Samsung AVP, SemiFive, Siemens, Synopsys |
||
|
16:15 - 16:30 |
15’ | Closing | Closing |
|
16:30 - 17:30 |
60’ | Partner Pavilion & Networking |
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原文標(biāo)題：【今日開(kāi)展】芯和半導(dǎo)體多項(xiàng)技術(shù)演示亮相SFF & SAFE? Forum 2023
文章出處：【微信號(hào)：Xpeedic，微信公眾號(hào)：Xpeedic】歡迎添加關(guān)注！文章轉(zhuǎn)載請(qǐng)注明出處。
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