This user's guide describes how the Keysight 86060C-series lightwave switches cover a broad range
2019-04-01 10:22:27
(stacked die)失效點的深度預估Thermal EMMI 不需開蓋(Decap),亦可照出亮點,從相對位置中輕松判定是芯片本身(Die),還是封裝問題。甚至對于體積較大的PCB線路短路問題,都可偵測到失效點。上海宜特實驗室提供
2019-11-19 11:35:54
Thermal EMMI (InSb)Thermal EMMI是利用InSb材質的偵測器,接收故障點通電后產(chǎn)生的熱輻射分布,藉此定位故障點(熱點、亮點Hot Spot)位置,同時利用故障點熱輻射傳導
2018-09-12 09:24:37
請問各位,在軟件里,thermal noise參數(shù)怎么設置?用什么能測試出來噪聲的波形?
2013-09-22 14:52:31
F28335的封裝有個框叫thermal pad 它的作用是什么?可以不畫嗎?如果畫,在PCB上面是如何出現(xiàn)的?有沒有圖片可以看一下嗎?
2020-06-01 06:36:29
process, package, and expertise Fairchild has been able to provide unique system solutions. Green
2009-12-15 17:05:34
我正在開發(fā)一個基于 IMX8MP 板的項目,該板具有 Linux 5.10.72,當我嘗試讀取 thermal_zone0 溫度時,出現(xiàn)以下錯誤
#cat /sys/devices/virtual
2023-05-25 07:18:12
N-Channel MOSFETs. The internal synchronous power switches provide high efficiency without the use
2022-01-27 14:50:47
absorptive PIN diode solid state switches which provide superior performance in terms of high isolation and fast switching speed.
2019-10-10 06:42:27
LTspice中 Voltage Controlled Switches的使用方法
2021-07-09 06:20:15
MMIC熱阻Thermal resistance (qJC) values are supplied with eachMMIC in the Microwave
2009-06-13 00:04:49
Thermal是什么?有何配置?法?RK3399 Thermal是如何控制系統(tǒng)溫度的?
2022-03-08 06:20:02
模塊、Camera(1300萬、500萬)等應用類功能模塊。thermal-zones {soc_thermal: soc-thermal {polling-delay-passive = &
2017-12-05 15:15:33
allegro中作貼片封裝到底要不要Thermal Relief pad和Anti Pad,網(wǎng)上有的說要,有的說不要,個人認為不需要,大牛們給個意見!!
2013-03-09 16:00:35
allegro中作貼片封裝到底要不要Thermal Relief pad和Anti Pad,網(wǎng)上有的說要,有的說不要,個人認為不需要,大牛們給個意見??!
2013-03-09 16:02:39
@Provide和@Consume,應用于與后代組件的雙向數(shù)據(jù)同步,應用于狀態(tài)數(shù)據(jù)在多個層級之間傳遞的場景。不同于上文提到的父子組件之間通過命名參數(shù)機制傳遞,@Provide和@Consume擺脫
2023-09-27 16:21:36
請問為什么我打開udl文件后找不到Microsoft Jet 4.0 OLE DB Provide語句
2017-07-09 10:31:01
如何對Android7.1 RK3288 Thermal進行控制呢?
2022-03-04 06:29:29
100mΩ Switches? All Switches Current Limited? Integrated Under-Voltage Protection? Integrated Thermal
2015-12-17 10:54:27
%。thermal_zone 配置以 RK3399 的配置為例thermal-zones {soc_thermal: soc-thermal {polling-delay-passive = <
2017-09-05 17:21:16
switches. Infineon’s CoolGaN? and related power switches provide a very robust gate structure. When driven
2023-06-27 16:09:32
我現(xiàn)在在用DRV8432做步進電機驅動,在數(shù)據(jù)手冊中有THERMAL PAD這個引腳的描述,也就是新片底面的散熱盤,這個PAD要如何處理,可以直接接到GND或者AGND嗎,數(shù)據(jù)手冊里面沒有找相應的說明。
2019-03-06 07:12:10
Datasheet里有以下參數(shù):Junction to thermal pad resistance θJP is 10.24°C/W.Junction to ambient thermal
2019-04-15 14:17:52
output.This design is well suited to provide power for Type 1 (15W) Power over Ethernet (PoE) Power Source
2018-09-29 09:52:37
A CMOS op amp is utilized to provide two-channel signal clamping with room-temperature leakage
2008-11-24 09:55:0314 8-Lead LLP Thermal Performance and Design GuidelinesIntroductionThe new leadless leadframe package
2009-01-13 18:25:4520 up to 100mA• No external components• Internal thermal over load protection• Internal short circu
2009-01-19 17:10:3741 As the modular DC-DC converter industry realizes greater power densities, proper thermal management
2009-02-07 10:20:0614 Thermal resistance values for Cyclone III devices are provided for a boardmeeting JEDEC
2009-03-28 14:42:2037 Thermal characteristics of integrated circuitpackages have been and increasingly will bea major
2009-03-30 00:18:1727 Abstract: This application note will give a brief introduction to thermal theory and general layout
2009-04-21 11:51:0818 and printer applications. The devices utilize HVCMOS process technology to provide 16 high-voltage low-charge-injection SPST switches, controlled
2009-05-11 09:24:4819 Thermal energy transport: cause by temperature difference, high T -> low T ConductionHeat
2009-07-04 15:12:5413 Thermal Management - English (1st edition):Using multichannel temperature sensorsto save space
2009-09-02 11:48:3610 This work presents the modeling and analysis of EMI and thermal performancefor switch power supply
2009-10-17 11:44:3420 The LM92 is a digital temperature sensor and thermal windowcomparator with an I2C™ Serial Bus
2009-10-22 09:33:5219 switches using a CMOS process to provide high isolation and low insertion loss to 1 GHz. The ADG936 is an absorptive/matched dual SPDT with 50
2009-10-24 10:59:5914 thermal conductivity and high luminous efficiency based on ceramic substrate will provide highest level of flux output and thermal management
2009-11-13 16:15:2521 thermal conductivity and high luminous efficiency based on ceramic substrate will provide highest level of flux output and thermal management. F
2009-11-19 11:34:0824 Thermal Characterization of Packaged Semiconductor Devices:With the continuing industry trends
2009-11-29 17:16:0122 Thermal Considerations:Thermal management is an important part of the system design process.
2009-11-29 17:16:4013 THERMAL DESIGN OF POWER MOSFETS OPERATING IN PARALLEL
The objective of this paper is the thermal
2009-11-29 17:17:1325 Thermal transient characterization methodology for single-die and stacked structures:High-power
2009-11-29 17:18:5016 LDO Thermal Calculations
AgendaR26; Thermal parameters standards terminology and definitionsR26; Suitable packages for g
2010-04-16 10:59:3326 Thermal Ma
2010-05-06 17:58:1117 , is prone to thermal runawaywhen the fluorescent lamp does not strike. As aconsequence, either the switches are oversized to sustai
2010-05-07 22:22:5418 AgendaR26; Thermal parameters standards terminology and definitionsR26; Suitable packages for good
2010-07-30 09:39:1514 The ’HC4351, CD74HCT4351, and CD74HC4352 are digitally controlled analog switches which utilize
2010-08-13 14:12:559 The TPS2231 and TPS2236 ExpressCard power interface switches provide the total power management
2010-10-30 21:01:4316 The TPS2214A and TPS2216A PC Card power-interface switches provide an integrated power-management
2010-10-30 21:38:5113 The bq2004E and bq2004H Fast Charge ICs provide comprehensive fast charge control functions
2010-11-10 10:49:5423 NKK Switches近日推出符合RoHS規(guī)范的新款JS系列微型DIP開關,可選4或8個位置。JS系列DIP開關是一種端到端可折疊的開關,可進行通孔或表面安裝,額定值為2
2006-03-13 13:04:06480 POWERPCB中thermal及antipad的設置
Thermal Pad:這是為了減少散熱把元件PAD 和大塊銅皮以花焊盤的形式連接。(順便說說我對這個東西的了解,如果只從信號角度來講
2009-04-15 00:21:012332 of quantization and thermal noise, parameters which can significantly affect the signal-to-noise ratio (SNR) and signal-to-noise plus distortion
2009-04-16 16:58:51360 Abstract: Two common thermal-resistance values measured for IC packages are junction to ambient
2009-04-17 10:51:03999 Thermal Pr
2009-04-18 10:35:541248 of a CPU, FPGA, GPU, or other high-performance IC. When the thermal diode temperature exceeds a pre-defined trip point, a cooling fan switches on
2009-04-18 10:50:291020 Abstract: This note discusses the effects on switches when used to connect loads. High currents
2009-04-20 11:21:091661 Abstract: Two common thermal-resistance values measured for IC packages are junction to ambient
2009-04-24 13:52:131781 of quantization and thermal noise, parameters which can significantly affect the signal-to-noise ratio (SNR) and signal-to-noise plus distortion
2009-05-01 10:53:22367 Abstract: Current-limit switches are virtually ubiquitous in system controls. They provide a safe
2009-05-08 09:56:002771 Understand Thermal Derating Aspects of PWM ICs to Ensure the Best System Performance
Abstract
2009-05-29 08:36:501137 Add Thermal Monitoring to Reduce Data Center Energy Consumption
Abstract: Precise and adaptable
2009-05-29 11:01:30672 TV audio amplifiers—thermal test considerations for slim systems
Abstract: The thermal evaluation
2010-03-03 17:44:072165 This application note answers general frequently asked questions (FAQs) about analog switches
2010-09-19 10:53:431085 imagingand printer applications. The devices utilize HVCMOSprocess technology to provide 16 high-voltage lowcharge-njection SPST switches, controlled
2011-09-26 12:05:2615 PADS Thermal Pad和Anti pad的詳細說明,另外有關于過孔的電容電感值的詳細計算,是PCB LAYOUT的一份好的資料
2015-11-23 11:12:050 8-Lead LLP Thermal Performance and Design Guideleines
2017-03-24 16:24:091 Specifically designed to operate at 150 °C, the new 10 A T1010H TRIACs provide an enhanced performance in terms of power loss and thermal dissipation.
2017-09-22 16:27:193 Specifically designed to operate at 150° C, the new 16 A T1635H Triacs provide an enhanced performance in terms of power loss and thermal dissipation.
2017-09-23 09:12:518 Specifically designed to operate at 150° C, the new 20 A T2035H Triacs provide an enhanced performance in terms of power loss and thermal dissipation.
2017-09-23 09:15:504 switches using a CMOS process to provide high isolation and low insertion loss to 1 GHz.
2017-10-25 10:03:405 ADSP-21562/63/65 Compact Thermal Model
2021-01-29 16:13:348 ADSP-21566/67/69 Compact Thermal Model
2021-01-29 16:15:348 SPICE模型中還包括用來進行熱仿真的“熱模型(Thermal Model)”和“熱動態(tài)模型(Thermal Dynamic Model)”。首先介紹一下熱模型。希望通過以下的介紹能夠大致了解熱模型。
2023-02-14 09:26:292081 上一篇文章中,簡單介紹了SPICE模型中的熱模型(Thermal Model),它是用來進行熱仿真的SPICE模型之一。本文將簡單介紹另一個熱仿真用的SPICE模型,即熱動態(tài)模型(Thermal Dynamic Model)。
2023-02-14 09:26:29885 thermal core:thermal主要的程序,驅動初始化程序,維系thermal zone、governor、cooling device三者的關系。
2023-03-13 17:09:191412 RJF0609JSP 數(shù)據(jù)表 (60V - 1.5V Silicon N Channel Thermal FET Power Switching)
2023-03-24 19:25:460 RJF0604JPD 數(shù)據(jù)表 (60V, 5A Silicon N Channel Thermal FET / Power Switching)
2023-03-30 20:06:140 RJF0619JPD 數(shù)據(jù)表 (60V, 30A Silicon N Channel Thermal FET / Power Switching)
2023-03-31 18:48:400 RJF0411JPD 數(shù)據(jù)表 (40V, 34A Silicon N Channel Thermal FET Power Switching)
2023-05-15 18:56:480 RJF0614JSP 數(shù)據(jù)表 (60V, 1.5A N Channel Thermal FET Power Switching)
2023-05-15 18:59:160 RJF0609JSP 數(shù)據(jù)表 (60V - 1.5V Silicon N Channel Thermal FET Power Switching)
2023-07-11 18:42:200 RJF0410JPE 數(shù)據(jù)表 (40V - 40A - N Channel Thermal FET Power Switching)
2023-07-11 19:15:350 RJF0408JPD 數(shù)據(jù)表 (40V, 30A Silicon N Channel Thermal FET Power Switching)
2023-07-11 19:47:590 RJF0409JSP 數(shù)據(jù)表 (40V, 5A Silicon N Channel Thermal FET Power Switching)
2023-07-11 19:48:120 RJF0614JSP 數(shù)據(jù)表 (60V, 1.5A N Channel Thermal FET Power Switching)
2023-07-11 20:09:450 RJE0616JSP 數(shù)據(jù)表 (-60V, -4A Silicon P Channel Thermal FET / Power Switching)
2023-07-12 19:12:360 RJF0612JPE 數(shù)據(jù)表 (60V - 50A - N Channel Thermal FET / Power Switching )
2023-07-13 18:51:260 RJF0618JPE 數(shù)據(jù)表 (60V-40A Silicon N Channel Thermal FET / Power Switching)
2023-07-13 19:18:390 RJF0614DSP 數(shù)據(jù)表 (60V, 1.5A N Channel Thermal FET / Power Switching)
2023-07-13 19:30:430 RJE0617JSP 數(shù)據(jù)表 (-60V, -1.5A, P Channel Thermal FET / Power Switching)
2023-07-13 19:50:170 RJF0619JPD 數(shù)據(jù)表 (60V, 30A Silicon N Channel Thermal FET / Power Switching)
2023-07-13 19:54:490
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